Empreses emergents
2021
BARETEK BARCELONA DETECTOR TECHNOLOGIES SLDetectors de píxels de partícules/radiació Serveis d'encapsulat microelectrònic per a proves de concepte, prototipatge i petites produccions
Adreça
CAN MAGRANS sn, 08290 Cerdanyola del Vallès, Espanya
Propietat CERCA
Bellaterra, Spain
1991
Institut de Física d’Altes Energies (IFAE)
Contacte del Centre CERCA
DV
Dylan Valencia Pino
Institut de Física d’Altes Energies (IFAE)Altres accionistes públics catalans
Logotip
Àrees d'estat i deeptech
Estat de l'empresa i àrees de tecnologia profunda de l'empresaEstat de l'empresa
Àrea DeepTech
Informació sobre la spin-off
Descripció de l'empresa
Microelectronic Assembly Services: State of the art ASIC, FPGA and microcontroller assembly technologies
We are experts in radiation detectors:for high energy physics, medical and industry applications
We are experts in radiation detectors:for high energy physics, medical and industry applications
Descripció del producte
Flip chip - Flip chip with pixel pitch as small as 50 µm.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.