Startups
2021
BARETEK BARCELONA DETECTOR TECHNOLOGIES SL
Dirección
CAN MAGRANS sn, 08290 Cerdanyola del Vallès, España
Propiedad de CERCA
Bellaterra, Spain
1991
Institut de Física d’Altes Energies (IFAE)
Contacto del Centro CERCA
DV
Dylan Valencia Pino
Institut de Física d’Altes Energies (IFAE)Otros accionistas públicos catalanes
Logo
Estado
Estado de la empresaEstado actual de la empresa
Área DeepTech
Descripción
Descripción
Servicios de ensamblaje microelectrónico: Tecnología punta en ensamblaje de ASIC, FPGA y microcontroladores Somos expertos en detectores de radiación: para aplicaciones de física de altas energías, médicas e industriales.
Descripción del producto
Flip chip - Flip chip with pixel pitch as small as 50 µm.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.