Startups
2021
BARETEK BARCELONA DETECTOR TECHNOLOGIES SLParticle/radiation pixel detectors
Microelectronics packaging services for proof of concepts, prototyping, and small productions
Microelectronics packaging services for proof of concepts, prototyping, and small productions
Address
CAN MAGRANS sn, 08290 Cerdanyola del Vallès, Spain
CERCA ownership
Bellaterra, Spain
1991
Institut de Física d’Altes Energies (IFAE)
CERCA Center Contact
DV
Dylan Valencia Pino
Institut de Física d’Altes Energies (IFAE)Other Catalan Public owners
Logo
Status & Deeptech areas
Company Status & Company Deeptech AreasCurrent company status
DeepTech Area
Spinoff information
Company Description
Microelectronic Assembly Services: State of the art ASIC, FPGA and microcontroller assembly technologies
We are experts in radiation detectors:for high energy physics, medical and industry applications
We are experts in radiation detectors:for high energy physics, medical and industry applications
Product description
Flip chip - Flip chip with pixel pitch as small as 50 µm.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.
Solder ball deposition - Solder ball deposition capabilities down to 40 µm in diameter.
High Precision Pick and Place - Versatile platform with 5 µm placing precision for a variety of substrates sizes. With this precision it is possible to tile sensors next to each other almost without gaps.
Automatic wire-boding - Fully automated state of the art wire-bonder fitting different wire diameters for ASIC and power devices.
Reflow Oven - Reflow Oven to improve the quality of the soldering quality by cleaning oxidized surfaces.
High Resolution X-ray imaging - High Resolution X-ray imaging with 1 µm spatial resolution. Excellent solution for Non Destructing quality control micro-electronics
Bond Tester -Pull and shear capabilities for wire-bond, solder ball, and die attach. For quality control to optimize the process at the start and during production.